| Production capability and future development | |||
| Project | Current production capacity | Expected production capacity in the future | |
| Board area | Double sided board: 30,000 M2/per month Multiple-layer board: 9,000 M2/per month | Double sided board: 40,000 M2/per month Multiple-layer board: 20,000 M2/per month | |
| Size of the board | 510mm × 635mm | 610mm × 760mm | |
| Max layers | 8 | 18 | |
| Board thickness (Max) Board thickness (Min) | 3.6mm 0.2mm | 3.6mm 0.1mm | |
| Size of Machine Drilling Hole (Min) Size of Laser Drilling Hole(Min) | 0.3mm | 0.2mm 0.1mm | |
| Drilled hole tolerance | PTH±0.076mm NPTH±0.05mm | PTH±0.05mm NPTH±0.025mm | |
| Outline tolerance | Punch±0.15mm Punch±0.10mm | Punch±0.10mm Punch±0.10mm | |
| Aspect Ratio | 6:1 | 8:1 | |
| Line width/Line spacing | 3mil/3mil | 2mil/2mil | |
| Layer to layer registration tolerance | 3mil | 2mil | |
| Solder mask Plug hole | Diameter:Hole Diameter: 20mil | Diameter:Hole Diameter: 28mil | |
| Solder mask Bridge | 4mil | 3mil | |
| Multiple-layer board:Copper foil ( inside layer) (outside layer) | 2 oz 3 oz | 3 oz 4 oz | |
| Double sided board: Copper foil | 3 oz | 4 oz | |
| Blind hole /buried hole | Yes | Yes | |
| Technologies |  HAL OSP Chemical electroless gold Gold plating Gold finger plating(Tab plating) Carbon Mask Chemical electroless silver Chemical electroless tin Peelable Mask (Blue Gum) Jumping V-CUT | HAL OSP Chemical electroless gold Gold plating Gold finger plating(Tab plating) Carbon Mask Chemical electroless silver Chemical electroless tin Peelable Mask (Blue Gum) Jumping V-CUT Selective hard gold planting Selective electroless gold | |
| Environmental protection procedure | OSP Electroless gold Flash gold Electroless silver Electroless tin | Non-lead procedure Halogen-free chemical compound | |
| Primary equipment | |
| Drilling Plant | Electroless Copper Auto Line |
| Plating Auto Line | Dust-free Workshop |
| Test Workshop | Rout Workshop |
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