HAL, Gold plating, Gold finger plating, OSP, Chemical electroless nickel/gold, Chemical electroless nickel/gold + OSP, Chemical electroless tin, Chemical electroless silver, Carbon mask, Peelable mask (Blue Gum), Blind or Buried holes via PCB, Jumping V-CUT.
The newest technologies we are researching, exploiting and trial producing now:
We are evaluating and researching the new technology of copper plating such as the pulse plating evaluation. That will improve the copper plating quality and penetrating capacity and the reliability of MICROVIA. At the same time, the quality of 3/3mil and other fine can also be polished up.
Now we are using OSP and Chemical electroless gold techniques and evaluating and introducing into technologies on chemical electroless silver and chemical electroless tin. Non lead and other heavy metal, with surface smooth and good weld characteristics, these four kinds of surface treatment technologies totally meet the newest environmental protection standard of the European Union.
Researching and exploiting HDI: At present, Kingstar PCB Company acclimates the requirements of international PCB market, conducting special R&D on high-end PCB manufacturing technology such as HDI. Now, every kind of raw materials and equipments have been evaluated. The capability improvements of producing procedure have basically reached the producing requirements which improve our technology level to a new stage.
What main technologies we have at present:
